|
半导体器件. 收集和产生能量的半导体器件. 第2部分: 基于热能的热电能量收集
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
参考页数：29P.;A4
|
|
|
|
|
|
半导体器件. 微型机电装置. 第26部分: 微槽和针孔结构的描述和测量方法
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
参考页数：57P.;A4
|
|
|
|
|
|
半导体器件. 第16-1部分: 微波集成电路. 放大器
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
参考页数：236P.;A4
|
|
|
|
|
|
半导体器件. 收集和产生能量的半导体器件. 第1部分: 基于振动的压电能量收集
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
参考页数：44P.;A4
|
|
|
|
|
|
半导体器件. 微型机电装置. 第25部分: 硅基MEMS制造技术. 微键合区拉压和剪切强度的测量方法
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
参考页数：45P.;A4
|
|
|
|
|
|
电力电子转换器系统和设备用安全性要求.第1部分:总则
Safety requirements for power electronic converter systems and equipment - Part 1: General
参考页数：828P.;A4
|
|
|
|
|
|
电力电子转换器系统和设备用安全性要求.第1部分:总则.修改件1
Safety requirements for power electronic converter systems and equipment - Part 1: General; Amendment 1
参考页数：42P.;A4
|
|
|
|
|
|
铁磁谐振调压器
Standard for Ferroresonant Voltage Regulators
参考页数：35P.;A4
|
|
|
|
|
|
半导体器件. 第11部分: 基本和增强隔离用磁力和电容耦合器
Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
参考页数：45P.;A4
|
|
|
|
|
|
半导体器件. 微型机电装置. 第25部分: 硅基MEMS制造技术. 微键合区拉压和剪切强度的测量方法(IEC 62047-25-2016); 德文版本EN 62047-25-2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
参考页数：23P.;A4
|
|
|
|
|
