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半导体器件的机械标准化.第6-18部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列(BGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
参考页数：40P;A4
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半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
参考页数：76P;A4
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铁氧体软磁芯的术语和命名.第2部分:尺寸基准
Terms and nomenclature for cores made of magnetically soft ferrites - Part 2: Reference of dimensions
参考页数：17P;A4
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半导体器件的机械标准化.第6-16部分:半导体试验术语表和BGA、LGA、FBGA和FLGA用老化插座
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
参考页数：11P.;A4
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半导体器件的机械标准化.第6-17部分:表面安装半导体器件封装外形图绘制的一般规则.堆叠式封装的设计指南.精细倾斜球状网阵排列和精细栅格阵列(P-PFBGA和P-PFLAGA)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLAGA)
参考页数：58P.;A4
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半导体器件的机械标准化.第1部分:分立器件外形图的一般规则
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
参考页数：39P.;A4
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半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图绘制的一般规则.1.5mm、1.27mm及1.00mm小螺距球状和柱状端封装的设计指南
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
参考页数：
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半导体器件的机械标准化 第6-3部分:绘制表面安装半导体器件封装外形图的一般规则 四面扁平封装尺寸的测量方法
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
参考页数：34P;A4
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半导体器件的机械标准化 第6-6部分：表面安装半导体器件封装外形图绘制的一般规则 小爆距纹间表面网格阵列（FLAG）的设计指南
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term
参考页数：12P.;A4
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半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图绘制的一般规则.P-VSON的尺寸
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
参考页数：18P.;A4
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