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印刷电路板组件.第1部分:一般规范.使用表面安装和相关装配技术的焊接电气组件和电子组件的要求
Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
参考页数：48P;A4
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使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法. 第1部分: 未经表面处理的金属材料的腐蚀试验方法
Test method for erosion of wave soldering equipment using molten lead-free solder alloy -- Part 1: Erosion test method for metal materials without surface processing
参考页数：16P;A4
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电子组装技术. 第3部分: 焊接点的环境和耐久性试验方法选择指南
Electronics Assembly Technology -- Part 3: Selection guidance of environmental and endurance test methods for solder joints
参考页数：42P;A4
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环境试验. 第2-83部分: 试验. 试验Tf: 利用焊锡膏湿平衡法进行的表面安装设备(SMD)电子元件的焊接性试验
Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
参考页数：40P;A4
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表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-4部分:往复弯曲试验
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test
参考页数：17P;A4
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表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-3部分:往复落锤试验
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
参考页数：26P;A4
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表面安装技术.表面安装焊接接头的环境和耐久试验法.第1-5部分:机械剪切疲劳试验
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
参考页数：22P;A4
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质量评估系统.第2部分:电子元件和包装件检验用抽样检验方案的选择和使用
Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages
参考页数：18P;A4
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表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
参考页数：20P;A4
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表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-1部分:拉拔强度试验
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test
参考页数：18P;A4
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