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电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求(IEC 61190-1-3-2007 + A1-2010).德文版本EN 61190-1-3-2007 + A1-2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010
参考页数：41P;A4
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电子组装技术.电子模块
Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
参考页数：17P.;A4
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钎焊电子组件的工艺要求.第5部分:钎焊电子组件的再加工、改进和检修
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007
参考页数：41P.;A4
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钎焊电子组件的工艺要求.第3部分:通孔安装组件
Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003
参考页数：46P.;A4
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钎焊电子组件的工艺要求.第4部分:终端组件
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies (IEC 61192-4:2002); German version EN 61192-4:2003
参考页数：29P.;A4
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钎焊电子组件的工艺要求.第2部分:表面安装组件
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003
参考页数：64P.;A4
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钎焊电子组件的工艺要求.第1部分:总则
Workmanship requirements for soldered electronic assemblies - Part 1: General (IEC 61192-1:2003); German version EN 61192-1:2003
参考页数：74P.;A4
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表面安装技术. 第4部分: 湿度敏感器件的分类, 包装, 标记和处理
Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
参考页数：32P;A4
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环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热试验方法
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
参考页数：44P;A4
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印刷电路板组件.第2部分:分规范.表面安装焊接组件的要求
Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
参考页数：32P;A4
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