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印刷电路板组件.第3部分:分规范.通孔安装焊接组件的要求(IEC 61191-3-2017); 德文版本EN 61191-3-2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
参考页数：21P.;A4
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电气和电子设备用机械结构.IEC 60917和IEC 60297系列试验.第6部分:室内机柜安全方面(IEC 61587-6-2017);德文版本EN 61587-6-2017
Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets (IEC 61587-6:2017); German version EN 61587-6:2017
参考页数：21P.;A4
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电气和电子设备用机械结构.IEC 60917和IEC 60297系列试验.第6部分:室内机柜安全方面(IEC 61587-6-2017);德文版本EN 61587-6-2017
Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets (IEC 61587-6:2017); German version EN 61587-6:2017
参考页数：21P.;A4
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自动搬运的部件的封装.第1部分:用连续胶带对有轴向引线的部件进行胶带封装(IEC 60286-1-2017);德文版本EN 60286-1-2017
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:2017); German version EN 60286-1:2017
参考页数：14P.;A4
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电子设备用机械结构.IEC 60917和IEC 60297系列试验.第1部分:机柜,机架,插箱和机箱在室内条件下使用和运输的环境要求,试验设置和安全方面(IEC 61587-1-2016);德文版本EN 61587-1-2017
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation (IEC 61587-1:2016); German version EN 61587-1:2017
参考页数：53P.;A4
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印刷电路板组件.第4部分:分规范.接线端焊接组件的要求(IEC 61191-4-2017); 德文版本EN 61191-4-2017
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
参考页数：22P.;A4
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印刷电路板组件.第3部分:分规范.通孔安装焊接组件的要求(IEC 61191-3-2017); 德文版本EN 61191-3-2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
参考页数：21P.;A4
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半导体器件的机械标准化.第2部分:尺寸规格.修改件20
Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 20
参考页数：13P.;A4
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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统
Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
参考页数：152P.;A4
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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
参考页数：29P.;A4
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