|
Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
参考页数：12P.;A4
|
|
|
|
|
|
Printed electronics. Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
参考页数：18P.;A4
|
|
|
|
|
|
|
|
|
|
单、双面挠性印制板分规范
Specification for single and double sided flexible printed boards with through connections
参考页数：50
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
