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LED模块用直流或交流电子控制装置的性能要求.修改件1
D.C. or A.C. supplied electronic control gear for LED modules - Performance requirements; Amendment 1
参考页数：5P;A4
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分立半导体器件及集成电路.第5-2部分:光电元件.基本额定值及特性
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
参考页数：66P.;A4
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半导体器件.微电机装置.第7部分:无线电频率控制和选择用MEMS BAW滤波器和双工器
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
参考页数：56P;A4
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半导体器件.第14-5部分:半导体传感器.PN-结点半导体温度传感器
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
参考页数：37P;A4
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半导体器件.第14-1部分:半导体传感器.传感器用总规范
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
参考页数：42P;A4
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分立半导体器件及集成电路.第5-3部分:光电元件.测量方法
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
参考页数：90P.;A4
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半导体压模产品.第1部分:采购和使用
Semiconductor die products - Part 1: Procurement and use
参考页数：90P;A4
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半导体装置.微电机装置.第6部分:薄膜材料的轴向疲劳试验方法
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
参考页数：30P;A4
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半导体装置.微电机装置.第4部分:MEMS用总规范
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
参考页数：42P.;A4
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半导体设备. 第5-7部分: 光电设备. 光电二极管和光电晶体管
Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
参考页数：46P.;A4
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