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电气和电子部件及设备用参考命名法
Reference Designations for Electrical and Electronics Parts and Equipment
参考页数：28P.;A4
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频带控制和选择用表面安装压电装置. 标准外形和端头连接. 第2部分: 陶瓷外壳
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
参考页数：345P.;A4
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频带控制和选择用表面安装压电装置. 标准外形和端头连接. 第2部分: 陶瓷外壳
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
参考页数：8P.;A4
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半导体器件的机械标准化.第6-22部分:表面安装半导体器件封装外形图绘制的通用规则.硅细间距球阵列和硅细间距栅格阵列半导体封装的的设计指南(S-FBGA和S-FLGA)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
参考页数：34P;A4
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频率控制和选择用表面安装的压电器件.标准外形和端头连接.第2部分:陶瓷外壳
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
参考页数：168P;A4
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半导体器件的机械标准化.第6-12部分:表面安装半导体器件封装外形图绘制的一般规则.微型节距栅极矩阵列(FLGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
参考页数：37P;A4
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半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列(BGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
参考页数：1P;A4
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半导体器件的机械标准化 第6-1部分：表面安装半导体器件封装外形图绘制的一般规则 鸥翼引出线端的设计指南
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals
参考页数：7P.;A4
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半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.球状栅极阵列封装体(BGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
参考页数：1P.;A4
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半导体器件的机械标准化 第3部分:集成电路外形图绘制的一般规则
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
参考页数：113P.;A4
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